Nvidia Unveils Ultra, Rubin, Feynman Chips and Data Center Roadmap

Rapid Summary:

• Blackwell Ultra (B300 Series)

– Release: Second half of 2025.
– specs: Up to 288 GB of HBM3e memory, delivers a 50% performance uplift over B200 wiht a TDP of ~1,400 watts.
– Enhancements: Integrated Mellanox Spectrum Ultra X800 Ethernet switch for data connectivity.

• Rubin (Vera Rubin Platform)

– Release: Second half of 2026.- Performance: Delivers 50 petaflops FP4 inference per chip; full NVL144 racks reach up to an exaflop scale with TSMC’s advanced fabrication process (3nm).
– Integration: Features ARM-based “Vera” CPU with high bandwidth connections via NVLink interface.

• Rubin Ultra

– Release: Second half of 2027.
Provides up to:
Memory included: Upto One TB HBMCluster upgrades